摘要
在印制线路板上化学镀镍钯磷合金，研究了主盐、配位剂和工艺参数对沉积速率及镀层中钯含量的影响，获得了较优镀液配方和工艺条件：NiCh·6H2024g／L，PdChO.1g／L，NaH2P02·H2O 0.15mol／L，三羟甲基氨基甲烷（Tris）0.05mol／L，乙二胺20mL／L，温度65～70℃，pH8.5～9.0，时间20min。采用扫描电子显微镜和能谱仪对镀层的形貌和组成进行了表征，通过结合力测试、中性盐雾试验和可焊性试验测试了镀层性能。所得镍钯磷合金镀层光亮、孔隙率低，具有良好的结合力和耐蚀性，能满足PCB制作中的可焊性要求。
Abstract： Electroless Ni-Pd-P alloy plating was carried out on the surface of printed circuit board. The effects of the main salt, complexant, and process parameters on deposition rate and content of palladium in the deposit were studied. The optimal bath formulation and process conditions were obtained as follows： NiC12.6H20 0. l moUL, PdC12 0. l g/L, NaH2PO2·H20 0.15 mol/L, tris（hydroxymethyl）aminomethane 0.05 mol/L, ethylenediamine 20 mL/L, temperature 65-70℃, pH 8.5-9.0, and time 20 min. The surface morphology and elemental composition of the Ni-Pd-P alloy deposit were characterized by scanning electron microscopy and energy-dispersive spectroscopy. The properties of the deposit were examined by adhesion test, neutral salt spray test, and solderability test. The Ni-Pd-P alloy deposit obtained is bright, has low porosity, good adhesion, high corrosion resistance, and favorable solderabilitv, meeting the requirement of PCB manufacture.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2015年第20期1150-1154,I0002,共6页
Electroplating & Finishing
关键词
印制线路板
化学镀
镍钯磷合金
可焊性
耐蚀性
printed circuit board
electroless plating
nickelLpalladium-phosphorus alloy
solderability
corrosion resistance
