摘要
主要对化学镍钯金表面处理工艺原理进行介绍,通过挠性电路板化学镍钯金后引线健合能力、可焊性、抗老化等一系列可靠性测试,验证其相对其它表面处理技术更加优越,特别适用于表面贴装混合组装板等要求高连接可靠性的产品上,并且满足无铅组装工艺所有需求,非常适合挠性板、封装基板等的表面处理PCB制造。
This article mainly introduced the reference process principle of ENEPIG surface treatment technology, through the FPC board after ENEPIG bonding ability, weldability, aging resistance and a series of reliability test, veriifcation of its more superior than other surface treatment technology, especially suitable for SMT mixed assembling plate for high connection reliability of products, and meet the demand of all lead free assembly process, very suitable for FPC board, packing substrate surface treatment of PCB manufacturing.
出处
《印制电路信息》
2013年第S1期327-334,共8页
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