摘要
为降低LTCC基板加工材料成本,在全银基板上化学镀镍钯金(ENEPIG)方案具有明显的成本优势和工艺优点。本文从银导体烧结形貌出发,对比了不同阻焊材料的抗酸碱腐蚀性,分析了内层银导体厚度对基板平面度的影响。针对化学镀存在的金层渗镀和漏镀、陶瓷腐蚀、镀层剥离、金层发白和色斑等问题,从机理上分析了问题产生的原因,提出了有针对性的解决办法。
In order to reduce the cost of LTCC materials continually,electroless nickel electroless palladium immersion gold(ENEPIG)technology based on silver conductor has the advantage of cost effective and unique process feature.In this paper,the morphology of co-fired silver conductor was studied firstly.To get the strongest ability of corrosion resistance,three kinds of solder mask materials were compared.The thickness of silver conductor belonged to inner layer was thinned to optimize the flatness of LTCC substrates.At last,this article introduced several common quality defects of ENEPIG process which included diffusion coating,plating leakage,ceramic corrosion,coating stripping,blushing and colored spots of gold.Furthermore,by analyzing the reason,the corresponding solutions were put forward to improve the reliability of LTCC substrates.
作者
陈晓勇
贾少雄
王颖麟
李俊
Chen Xiaoyong;Jla Shaoxiong;Wang Yinglin;Li Jun(The 2nd research institute of China Electronics Technology Group Corporation,Taiyuan 030024,China)
出处
《印制电路信息》
2021年第6期52-56,共5页
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