摘要
我们将国内外报道化学镀镍金的部分最新研究成果,同我们实验室的实践相结合,对造成化学镀镍金可焊性差的多种因素作一简要介绍。本文总结了影响化学镀镍金可焊性的复杂因素如:前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。
Based on the domestic and foreign reports, we combine part of the newest research achievements with our laboratory practice. Factors influencing the solder ability of electro less nickel and immersion gold layer were briefly introduced. This paper servers as a summary review of the complex factors such as the prepare, the process of electro less nickel, immersion gold, the rinse alter immersion gold, the solder.
出处
《印制电路信息》
2006年第4期40-43,共4页
Printed Circuit Information
关键词
化学镀镍
浸金
可焊性
electro less nickel immersion gold solderability
