摘要
根据不同的助焊剂性能特点,总结了溶剂、活性剂、触变剂、抗氧化剂等在助焊剂成分中的研究进展,对无铅焊膏逐渐取代含铅焊膏的现状进行了分析,同时探究助焊剂的成分配比和铺展性能,提出合理的成分方案,并对助焊剂的发展前景进行了展望。
According to the different flux characteristics, the research development of the solvent, surfactant,thixotropic agent, antioxidant and etc. in flux composition was summarized, and the status quo of lead-free solder paste instead of leaded solder paste gradually replaced was analyzed. And then, a reasonable composition scheme was put forward by exploring the flux ratio of ingredients, spreading performance, and the development prospect of flux was discussed.
作者
穆荻
刘旭东
孙旭东
MU Di;LIU Xu-dong;SUN Xu-dong(College of Environmental and Chemical Engineering,Dalian University,Dalian 116622,Liaoning Province)
出处
《沈阳工程学院学报(自然科学版)》
2020年第2期86-91,共6页
Journal of Shenyang Institute of Engineering:Natural Science
基金
云南省科技厅重大科技项目(No.2018ZE-001)。
关键词
无铅焊膏
助焊剂
铺展性能
Lead-free solder paste
Flux
Spreading performance