摘要
纳米粒子由于尺寸效应,可导致其熔点降低。对于无铅焊料而言,熔点的降低将减少因高熔点无铅焊料的使用而带来的封装过程的缺陷。通过电弧法制备了Sn3.5Ag合金的纳米粒子。X射线衍射(XRD)及能谱(EDS)测试结果证明,母合金及所制备的纳米粉末中,都形成了金属间化合物Ag3Sn相,说明该制备过程的合金化完全。SEM二次电子像和TEM明场像结果说明所制备的纳米粒子呈球状,且尺寸均在50 nm以下,部分甚至小于10 nm。差示扫描量热仪(DSC)的测试结果证实所获SnAg纳米粒子的平衡熔点约为198.6℃,较之块状样品的平衡熔点(221℃)降低约22℃。说明采用纳米技术可以获得低熔点的Sn基纳米无铅焊料,是很有潜力的获取低熔点无铅焊料的技术途径。
The melting temperature of nano particles was anticipated to decrease due to its size effect. As for Pb-free solder, the decreasing of melting temperature was beneficial to reduce the defects in electronic packaging caused by high mehing solders. The Sn3.5Ag nano particles were prepared by arc technique. And AggSn intermetallic was produced both in the bulk master alloy and as-prepared nano particles, confirmed by the X-ray diffraction （XRD） and energy dispersive spectroscopy （EDS） , reflecting the successful alloying of the original Sn and Ag elements. The nano particles were in spherical shape and the size was smaller than 50 nm, with some of them even smaller than 10 nm. Based on the differential scanning calorimetry （DSC） measurement, the melting temperature of the Sn3.5Ag nano particles was as low as 198.6 ℃, 22 ℃ lower than that of the bulk alloy （221 ℃ ）, indicating the great potential to develop novel low melting Pb-free solder alloy.
出处
《上海金属》
CAS
北大核心
2013年第6期14-17,共4页
Shanghai Metals
关键词
Sn3
5Ag
无铅焊料
纳米粒子
熔点降低
Sn3.5Ag, Pb-free Solder, Nano Particle, Melting Temperature Decrease
