摘要
通过调整Sn-Bi-Ag-In无铅焊粉与助焊剂的比例,制备了不同回流焊焊点,并对焊点的铺展率、润湿角、金属间化合物特征及显微硬度进行了研究。结果表明:当回流时间为2 min时,随着焊膏中助焊剂质量比从10%提高至20%,焊点的铺展率从63%提高至83%,润湿角从33.7°降低至16.0°。在润湿性提高的同时,焊点界面金属间化合物层的厚度有所增加。此外,随着助焊剂比例的增加,焊点的显微硬度提高。
Different reflow solder joints were prepared by adjusting the percentage of lead-free Sn-Bi-Ag-In solder powder to flux, and the spreadability, wetting angle, characteristics of the intermetallic compounds and microhardness of solder joints were investigated. The results showed that when the reflow time was 2 min, with the increase of flux percentage from 10% to 20%, the spreadability of solder joints increased from 63% to 83%, and the wetting angle decreased from 33.7° to 16.0°. The thickness of intermetallic compounds(IMC) layer at the solder joints interface also increased due to the higher wettability. In addition, the microhardness of solder joints increased with the increase of flux percentage.
作者
李振
吴贯之
丁凯
李顺
高玉来
LI Zhen;WU Guanzhi;DING Kai;LI Shun;GAO Yulai(Center for Advanced Solidification Technology(CAST),Shanghai University,Shanghai 200444,China;School of Materials Science and Engineering,Shanghai University,Shanghai 200444,China;State Key Laboratory of Advanced Special Steel,Shanghai University,Shanghai 200444,China)
出处
《上海金属》
CAS
2022年第2期65-71,共7页
Shanghai Metals
基金
国家自然科学基金(52071193)。
关键词
无铅焊粉
助焊剂
润湿性
金属间化合物
显微硬度
lead-free solder powder
flux
wettability
intermetallic compound
microhardness
