摘要
焊接后出现桥连、短路是高密度电子组装中经常遇到的问题。通过回流焊接实验和抗热塌性实验,研究了助焊剂中溶剂的复配对焊锡膏抗热塌性的影响。结果表明:四氢糠醇与丙二醇苯醚按质量比3:2复配得到的焊锡膏焊点光亮饱满,铺展率达到84.83%,抗热塌性(150℃)优异。四氢糠醇与聚乙二醇单甲醚250(MPEG250)按质量比1:1复配得到的焊锡膏助焊性良好,焊点铺展率高达86.55%,具有优异的抗热塌性(150℃),并在180℃下仍表现优异,且最小不桥连间距为0.06 mm,满足超细间距条件下的焊接要求。
Bridging and short-circuit are the common problems in high density electronic packaging. The effects of compound solvents in flux on the anti-hot slump of solder paste were studied by reflow soldering and anti-hot slump test. The results show that mixed with tetrahydrofurfuryl alcohol and propylene glycol monophenyl ether （mass ratio=3：2） as solvent, the solder paste has good anti-hot slump ability （150 ℃）.The spreadability is 84.83% and the appearance of spots is plump, beamy. Mixed with tetrahydrofurfuryl alcohol and MPEG250 （mass ratio=1：1） as solvent, the solder paste has good soldering and excellent anti-hot slump ability（150 ℃）, and the spreadability is as high as 86.55%.The solder paste still has excellent anti-hot slump ability at 180 ℃ and the minimum non bridging space is 0.06 mm.The solder paste meets the requirement of ultra-fine pitch technology.
出处
《电子元件与材料》
CAS
CSCD
2017年第11期73-77,共5页
Electronic Components And Materials
基金
陕西省教育厅重点实验室科研计划项目资助(No.14JS069)
关键词
无铅焊锡膏
细间距
溶剂
助焊性能
铺展率
抗热塌性
lead-free solder paste
fine-pitch
solvent
solderability
spreadability
anti-hot slump ability
