摘要
本文将两种不同粒度分布(T4:20~38μm;T6:5~15μm)的焊锡粉以不同质量配比与自制助焊剂制成锡膏。采用旋转黏度计、扫描电子显微镜(SEM)、能谱仪(EDS)等分析测试手段,研究了锡粉粒度对SAC305锡膏黏度、铺展性以及微观界面化合物变化规律的影响。结果表明:T6锡粉质量分数为10%~50%时,随着T6锡粉质量分数的增加,锡膏黏度逐渐增加,铺展面积先增加后减小;当T6锡粉质量分数为40%时,锡膏黏度为194 Pa·s,满足印刷锡膏的黏度要求,铺展面积最大为163 mm^(2)。
In this paper,two different particle size distributions of tin powder(T4∶20~38μm,T6∶5~15μm)with different proportion and self-made flux were made into solder paste.The effects of solder powder particle size on the viscosity,spreadability and micro interface compound of SAC305 solder paste were studied by means of rotary viscometer,scanning electron microscope(SEM)and energy dispersive spectrometer(EDS).The results show that when the mass fraction of T6 tin powder is 10%~50%,the paste viscosity gradually increases and the spreading area first increases and then decreases with the increase of T6 tin powder.When the mass fraction of T6 tin powder is 40%,the viscosity of solder paste is 194 Pa·s,which meets the viscosity requirements of printing solder paste,and the maximum spreading area is 163 mm^(2).
作者
许国栋
闫焉服
高婷婷
李永康
XU Guodong;YAN Yanfu;GAO Tingting;LI Yongkang(Materials Science&Engineering School,Henan University of Science&Technology,Luoyang 471023,China)
出处
《河南科技大学学报（自然科学版）》
CAS
北大核心
2022年第6期12-16,M0003,共6页
Journal of Henan University of Science And Technology:Natural Science
基金
国家自然科学基金项目(5117151)
河南省杰出青年基金项目(144100510002)。
关键词
锡粉粒度
SAC305锡膏
黏度
润湿性
Particle size of tin powder
SAC305 solder paste
viscosity
wettability
