摘要
自主设计了热循环下钎焊接头电迁移试验装置,探究了热循环下电流密度对Sn2.5Ag0.7Cu0.1RE/Cu无铅钎焊接头界面及组织性能的影响。研究结果表明:在电流密度达到7.0×10~3A/cm^2时,出现明显的电迁移现象。随电流密度增加,钎焊接头阳极区金属间化合物(IMC)厚度显著增加,增厚的化合物主要是Cu_6Sn_5;阴极区IMC厚度呈幂指数缓慢增加,主要表现为Cu_3Sn的生长,且在阴极区与钎缝过渡区域出现裂纹和孔洞。钎焊接头发生电迁移后剪切强度降低50%,断裂发生在阴极界面IMC上,剪切断口呈脆性断裂。
The effect of current density on the interface and the microstructure properties of Sn2.5Ag0.7Cu 0.1 RE/Cu lead-free solder joints under thermal cycling was investigated by self designed solder joint electromigration test device. The results show that electromigration is obvious when the current density reaches 7. 0 × 10~3A/cm^2. With the increase of current density,anode thickness of intermetallic compound( IMC)brazing joints increases significantly,and the thickening compound is Cu_6Sn_5. The cathode region thickness of IMC exponentially increase slowly,and the growth is mainly Cu_3Sn. In the cathode region and the transition region of brazing seam there are cracks and holes. The brazing shear strength decrease 50% after electromigration. The fracture occurs at the cathode interface of IMC. Shear fracture is brittle fracture.
出处
《河南科技大学学报（自然科学版）》
CAS
北大核心
2017年第6期1-6,共6页
Journal of Henan University of Science And Technology:Natural Science
基金
国家自然科学基金项目(U1604132)
河南省高校科技创新团队支持计划基金项目(13IRTSTHN003)
河南省科技创新杰出人才计划基金项目(154200510022)
关键词
无铅钎焊
电迁移
热循环
界面尺寸
剪切强度
lead-free soldering
electromigration
thermal cycling
interface size
shear strength
