摘要
利用XRD、SEM及EDAX研究了钎焊和时效过程中低银Sn-2.5Ag-0.7Cu(0.1RE)/Cu焊点界面区显微组织和Cu6Sn5金属间化合物的生长行为。结果表明,钎焊过程中焊点界面区Cu6Sn5金属间化合物的厚度是溶解和生长两方面共同作用的结果;随时效时间的增加,焊点界面区Cu6Sn5的形貌由扇贝状转变为层状,其长大动力学符合抛物线规律,由扩散机制控制;添加0.1%(质量分数,下同)的RE能有效减慢界面Cu6Sn5金属间化合物在钎焊及时效过程中的长大速度,改变焊点的断裂机制,提高其可靠性。
The microstructure of low-Ag-content Sn-2.5Ag-0.7Cu（0.1RE）/Cu solder joint interface and growth behavior of Cu6Sn5 intermetallic compound （IMC） were investigated by XRD, SEM and EDAX. The results show that the Cu6Sn5 thickness of the solder joint interface is decided by its dissolution and growing during soldering. With the aging time increasing, the Cu6Sn5 morphology of the solder joint interface changed from scallop-like to lamellar; the growth dynamics follows the parabola law and its growth behavior is controlled by diffusion mechanism. Addition of 0.1% RE （mass fraction） in the Sn-2.SAg-0.7Cu solder alloy can effectively reduce the growing rate of the solder joint Cu6Sn5 IMC during the soldering and aging period, and change the fracture mechanism of solder joirit; therefore the reliability of the solder joint can be greatly improved.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2010年第1期117-121,共5页
Rare Metal Materials and Engineering
基金
国家自然科学基金(50774029)
河南省高校创新人才基金(教高2004-294)
河南省高校杰出科研人才创新工程项目(2004KYCX020)
河南省杰出青年科学基金(074100510011)
