摘要
TSV硅转接板是3D IC封装技术的一项重要应用,其力学可靠性是影响系统集成的关键问题。以某TSV硅转接板封装结构为对象,采用有限元方法开展了封装、服役过程中应力应变特性和热疲劳寿命研究,分析了基板材料对封装结构力学可靠性的影响,提出了基板材料优选思路。论文提出的分析方法可用作此类封装结构设计优化以及结构力学可靠性初步验证的手段,可以提高设计效率,缩短研制周期。
The silicon interposer packaging architecture is widely applied in 3D-TSV,and mechanical reliability is one of the critical problemsforsystem integration.A finite element analysis method was used to study the stress characteristic,strain characteristic and thermal fatigue life of the packaging architecture with TSV interposer during the packaging process and the service process.The influence of substrate material on the mechanical reliability of the packaging architecture was studied by FEM,and an optimization method of the substrate materials was proposed according to the FEM results.The proposed analysis method can be used to optimize the packaging architecture,verify the mechanical reliability,improve the design efficiency,and shorten the development cycle.
作者
杨静
王波
刘勇
YANG Jing;WANG Bo;LIU Yong(China Electronics Technology Group Corporation No.38 Research Institute,Hefei 230088,China;Global Research Center for Flexible Electronic&Intelligent Technology,Hangzhou 310012,China)
出处
《电子与封装》
2019年第10期4-7,12,共5页
Electronics & Packaging
基金
国防预研项目(31513050103)
关键词
封装
硅转接板
焊球
基板
热疲劳寿命
packaging
silicon interposer
solder ball
substrate
thermal fatigue life
