摘要
应用弹粘塑性有限元法对芯片叠层球栅阵列尺寸封装的焊球,在热循环条件下(-40～125℃)进行了数值模拟,并在此基础上进行了可靠性分析。由于封装体内不同材料间热膨胀的不匹配会在焊球连接上产生很大的塑性形变。在热循环加载条件下,最终会萌生裂纹,致使整个芯片失效。本文基于ANSYS有限元分析软件,以塑性应变能作为研究对象,讨论了焊球的可靠性分析方法,最后利用子模型法探讨了网格的疏密对焊球寿命的影响。
Viscoplastic finite-element simulation methodologies were utilized to predict solder joint reliability for a same die size, stacked, chip scale, ball grid array package under accelerated temperature cycling conditions (-40～125 ℃). Due to the thermal expansion mismatch between the various package materials, the deformation will be accumulated, ultimately causes solder joint cracking and the whole package failure. The paper discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool, and the effect to the fatigue life by changing the dimension of the element with the sub-model methodology.
出处
《浙江工业大学学报》
CAS
2004年第6期668-673,共6页
Journal of Zhejiang University of Technology
基金
国家自然科学基金资助项目(10372093)
