摘要
建立了工业级FPGA的热分析模型,采用先模块后器件两步分析方法,研究了在热传导和辐射条件下模块盒体、导热衬垫热传导系数、厚度及压力对FPGA散热性能的影响。分析了FPGA芯片内部热分布的状态,提出了工业级FPGA空间应用的散热设计方案。研究表明,通过增加模块盖板厚度、优化器件布局、采用高导热系数导热衬垫,可以使工业级FPGA芯片结温满足一级降额要求。
The thermal analysis module of industry FPGA is founded. Using module and component twostep analysis method, the effects to heat dissipation capability by module case, heat exchange coefficient of heat pad, thickness and pressure is studied under conduct and radicalization condition. The state of inside heat distributing is also analyzed and the thermal design scheme of industry FPGA in space application is presented. The results show that chip junction temperature of industry FPGA can meet the derating design requirement while increasing the cover thickness, optimizing parts layout and using high thermal conductivity material.
出处
《电子与封装》
2014年第12期29-32,共4页
Electronics & Packaging
关键词
工业级FPGA
热设计
传导
辐射
降额设计
有限元
industry FPGA
thermal design
conduction
radialization
derating design
finite element
