摘要
针对宇航电子设备大功率器件的散热路径进行了分析。对顶部散热的器件采用高导热石墨板、精确控制导热垫压缩量、增加导热路径等方式进行散热,对腹部散热的器件采用覆铜通孔等方式进行散热,并结合热仿真和温循试验,有效解决了大功率器件散热问题。
This paper analyzes the heat dissipation path of the high power components in aerospace electronic equipment.High thermal conductivity graphite sheet,accurately control of heat conduction pad compression and increase of heat conduction path are used for component which heat dissipation through the top.Covering the vias with copper are used for component which heat dissipates through the bottom.Combined with thermal simulation and temperature cycle test,the heat dissipation problem of high power component is effectively solved.
作者
崔冠宇
王宇
郭益
薛小龙
王雁翔
CUI Guanyu;WANG Yu;GUO Yi;XUE Xiaolong;WANG Yanxiang(Beijing Research Institute of Telemetry,Beijing 100076,China)
出处
《遥测遥控》
2021年第4期89-94,共6页
Journal of Telemetry,Tracking and Command
基金
国家自然科学基金重大科研仪器研制项目高速目标等离子体电磁信号多维度特征测量及通信技术研究(6162790108)。
关键词
大功率器件
石墨板
热仿真
High power component
Graphite sheet
Thermal simulation
