摘要
3D-TSV封装技术是实现多功能、高性能、高可靠且更轻、更薄、更小的系统级封装最有效的技术途径之一。3D-TSV封装关键技术包括:通孔制作、通孔薄膜淀积、磁控溅射、通孔填充、铜化学机械研磨、超薄晶圆减薄、芯片/晶圆叠层键合等。阐述了每种关键技术的工艺原理、技术特点、应用范围及发展前景,关键设备、关键材料以及TSV在三维封装技术中的应用。
3D-TSV package technology is the best impactful technique approach to achieve three dimension system package with multifunction,high-performance,high-reliability,more light weight,thinner,smaller.The paper presented several key technologies of 3D-TSV package,such as,via fabrication,film deposition on via sidewall,via filling,copper CMP,ultra-thin wafer grinding,chip/wafer stacking bonding.And discussed techno-theory,techno-characteristic,application area,development status of key technologies,the key equipments,the key materials,and application of 3D-TSV package technology.
出处
《电子与封装》
2014年第7期1-5,共5页
Electronics & Packaging
