摘要
介绍了在2.5D封装中运用简化工艺进行硅转接板双面电镀的电镀槽功能模块及其设计原理。
The function module and design principle of the electroplating cell are introduced for the double-sided electroplating of the silicon interposer electroplating by using the simplified technology in the 2.5 Dimension(2.5D)package.
作者
陈苏伟
吴光庆
曹秀芳
张伟峰
解坤宪
CHEN Suwei;WU Guangqing;CAO Xiufang;ZHANG Weifeng;XIE Kunxian(The 45th Research Institute of CETC,Beijing 100176,China)
出处
《电子工业专用设备》
2020年第2期34-38,共5页
Equipment for Electronic Products Manufacturing
关键词
2.5D封装
简化工艺
硅转接板
双面电镀
电镀槽
2.5D package
Simplified process
Silicon interposer
Double-sided electroplating
Electroplating cell
