摘要
设计了一种利用球栅阵列(BGA)的毫米波垂直互联,解决了毫米波系统三维(3D)集成时层间信号互联的低损耗传输问题。根据传输线理论,利用电磁仿真软件对这种采用BGA的垂直互联进行了仿真,并对层间通孔半径、焊球半径、焊盘半径等对传输性能的影响进行了分析。样件测试结果显示,在28.4~30.4 GHz,其层间垂直传输损耗小于0.36 dB,反射小于-15 dB。该垂直互联结构简单、性能良好,可广泛用于毫米波微系统3D集成。
The design of a millimeter wave( MMW) vertical interconnection with ball grid array( BGA) is presented in this paper,which solves the problem of low loss transmission between interlayers in the three dimensional( 3D) integration process. According to the transmission line theory,the vertical interconnection of BGA is simulated with electromagnetic simulation software. The influence of interlayer through-hole radius,BGA solder ball radius and pad radius on transmission performance is analyzed. Sample test result shows that the transmission loss is less than 0. 36 dB and the reflection is less than -15 dB between 28. 4 GHz and 30. 4 GHz. The vertical interconnection has a simple structure and good performance,which can be widely used in 3D integration of MMW microsystems.
出处
《电讯技术》
北大核心
2017年第7期825-829,共5页
Telecommunication Engineering
基金
中国西南电子技术研究所发展创新基金(H15028)
关键词
毫米波微系统
垂直互联
球栅阵列
3D集成
millimeter wave microsystem
vertical interconnection
ball grid array(BGA)
3D integration
