摘要
在瓦片式T/R组件中,射频信号从内部腔体到外部辐射单元的垂直传输对于组件整体性能有着重要影响。为实现有效的垂直互连,提出了一种组件腔体内微带线经由偏置带状线、拟同轴过孔、锡球、盖板过孔与mini-SMP接头互连至辐射单元的方法。应用HFSS电磁场仿真软件对其进行了仿真优化,确定关键结构参数。采用所述互连方式加工了低温共烧陶瓷(LTCC)封装的瓦片式发射/接收(T/R)组件,测试结果表明该结构能够实现良好的垂直互连。
In tile T/R module, the vertical transmission of RF signal from module cavity to radiating unit out- side has a great influence on performance of the whole structure. A method is proposed to realize effective vertical interconnection. Microstrip in the cavity is connected to radiating unit through offset strip line, coaxial vias, Sn balls, vias in the lid and mini-SMP connector. The whole structure is simulated and optimized with EM simulation software HFSS. Parameters of emphasized structures are determined. LTCC tile T/R module utilizing the method mentioned is manufactured and test result shows the vertical interconnection structure contributes to adequate per- formance.
出处
《科学技术与工程》
北大核心
2013年第11期3104-3108,共5页
Science Technology and Engineering
