摘要
本文介绍了系统级封装技术及其兴起背景,对比了与SoC的异同。通过分析系统级封装的技术特点,阐述了其优势;分析了系统级封装的成本构成和特点。本文从集成电路产业链整合的观点,分析了国内系统级封装的机遇与挑战;以长电科技为例,介绍了系统级封装在设计、制造上的关键技术与当前的能力,并分析了未来的趋势和挑战。本文还对当前的系统级封装产品与应用领域做了详细介绍。
This paper introduced System in Package technology and the background, made a deep comparison with SoC technology. The advantages of SiP technology are demonstrated by analyzing the technical characteristics. The BOM constitution and cost characteristics of SiP are also analyzed. This paper analyzed the opportunities and challenges of domestic SiP industry in the point of view of IC industry integration, introduced the key techniques and the current capability in SiP designing and manufacturing, taking JCST as a example, and also analyzed the potential trends and challenges. This paper also gave a detail introduction of SiP products and the application.
出处
《中国集成电路》
2009年第12期56-62,共7页
China lntegrated Circuit
基金
国家重大科技专项项目(项目编号:2009ZX02025)资助
关键词
系统级封装技术
系统级封装工艺
系统级封装设计
系统级封装产品
System in Package technology
System in Package process
System in Package designing
System in Package product
