摘要
为研制更高热导率的产品,采用粉末冶金法将金刚石与高纯度铜粉热压在一起,制备新型金刚石/铜复合材料。通过正交分析法,研究了金刚石/铜复合材料热导率的影响因素。结果表明:用粉末冶金法制备的金刚石/铜复合材料,其热导率最高为245.89 W/(m·K)。对金刚石/铜复合材料热导率影响最大的因素是金刚石与铜粉的体积比,并且随着体积比的增大,金刚石/铜复合材料热导率逐渐下降。金刚石/铜复合材料的致密度以及界面结合程度是影响金刚石/铜复合材料热导率大小的重要因素,致密度高、界面结合好的复合材料热导率高,反之则低。
To prepare material with higher thermal conductivity,new diamond/copper composite material was hot-pressed using powder metallurgy method with diamond and high purity copper powders.Orthogonal analysis was used to study the influencing factors of thermal conductivity of diamond/copper composite material.Results showed that maximum thermal conductivity of new material was 245.89 W/（m爛K）and that volume ratio of diamond to copper powders influenced thermal conductivity most. With the increase of volume ratio,thermal conductivity of diamond/copper composite material gradually decreased.Densification and interface bonding factor were important factors as well.Composite material with higher densification and better interface bonding possessed higher thermal conductivity and vice versa.
出处
《金刚石与磨料磨具工程》
CAS
2016年第1期79-82,90,共5页
Diamond & Abrasives Engineering
关键词
金刚石/铜复合材料
正交试验
粉末冶金
热导率
diamond/copper composite material
orthogonal experiment
powder metallurgy
thermal conductivity
