摘要
电子技术的快速发展对封装材料的性能提出了更严格的要求。针对封装材料的发展趋势,金刚石/铜复合材料作为新一代的电子封装材料受到了广泛的重视,概述了金刚石/铜复合材料作为封装材料的优良性能及其制备工艺进展,并对其发展方向进行了展望。
The rapid development of electronic technology has led to strict requirement for the properties of electronic packaging material. According to the new development of packaging material, diamond/ Cu composites as a new generation electronic packaging material has received more and more attention. The favorable characteristics and basic preparation technology of Diamond - Cu composite material for electronic packaging are reviewed. And the tendency to develop Diamond - Cu composite material for elec- tronic packaging is reviewed.
出处
《电子工艺技术》
2009年第1期5-8,共4页
Electronics Process Technology
关键词
电子封装
金刚石/铜复合材料
热导率
热膨胀系数
Electronic packaging
Diamond - Cu composite material
Thermal conductivity
Coefficient of thermal expansion
