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Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles 被引量:14

Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles
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摘要 The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.
出处 《Rare Metals》 SCIE EI CAS CSCD 2012年第1期58-63,共6页 稀有金属(英文版)
基金 financially supported by High-Technology Research and Development Program of China (No.2008AA03Z505)
关键词 diamond hybrid SiC/Cu composite MICROSTRUCTURE thermal conductivity differential effective medium diamond hybrid SiC/Cu composite microstructure thermal conductivity differential effective medium
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  • 1童震松,沈卓身.金属封装材料的现状及发展[J].电子与封装,2005,5(3):6-15. 被引量:50
  • 2石乃良,陈文革.电子封装用W/Cu复合材料的特性、制备及研究进展[J].材料导报,2007,21(F05):301-303. 被引量:10
  • 3Zweben C. Advanced materials for optoelectronic packaging [ J ]. Electron packaging prod, 2002,42 ( 9 ) : 37 - 40. 被引量:1
  • 4Katsuhito Yoshida, Hideaki Morigami. Thermal properties of diamond/copper composite material[ J]. Microelectronics reliability, 2004 (44) : 303 - 308. 被引量:1
  • 5Kems J A, Colella N J. Dymalloy:A composite substrate for high power density electronic components [ C ]. Proceeding of 1995 international symposium on mieroelectronics, Los angeles, 1995:66 - 72. 被引量:1
  • 6Agari Yasuyuki, Inour Kanryu. Thermal conductivity of copper composites dispersed with diamond particles prepared by spark plasma sintering [ J ]. Thernophys prop, 2006,27 : 328 - 330. 被引量:1
  • 7Q Sun, O T Inal. Fabrication and characterization of diamond/copper composites for thermal management substrate applications [ J ]. Materials science and engineering,1996,41 (2) :261 -266. 被引量:1
  • 8W Z Shao, V V Ivanov. A study on graphitization of diamond in copper- diamond composite materials [ J ]. Materials letters ,2004,58 ( 1 - 2) : 146 - 149. 被引量:1
  • 9刘辉,赵乃勤.纳米金刚石/铜基复合材料的摩擦磨损性能研究[DB/OL].http://www.paper.edu.cn/downloadpaper.php?serial_number=200704-385.2007-04-16. 被引量:1
  • 10王荣.梯度复合材料活塞的挤压铸造研究[C].2001年中国压铸、挤压铸造、半固态加工学术年会,烟台,2001. 被引量:3

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