摘要
作为组件封装材料,铝合金与芯片和电路基板之间存在热膨胀不匹配问题。采用热匹配工艺设计,选择合适的热匹配材料,为铝合金盒体与LTCC基板热膨胀匹配提供了一种理想解决方案。根据匹配设计理念,利用Abaqus有限元软件对热匹配材料及铝盒体的结构进行了仿真和优化,并与加工出试验样品的测试结果进行了对比,验证了模拟结果,为铝合金材料应用于电子封装探索出一条新的应用途径。
A key technology problem of aluminum alloys used as electronic packaging materials is the mismatch of thermal expansion between chip,ceramic substrate and aluminum alloys.Using a thermal matching technique design and choosing appropriate thermal matching material provides an ideal scheme for thermal matching between LTCC substrate and aluminum alloys.According to the thermal matching design idea,structures of LTCC substrate and aluminum alloy package were simulated and optimized by the Abaqus analysis software.According to the simulation and experiment results,the best choice of the structure to decrease thermal stress was concluded.Good agreement was acquired between the simulated results and the experimental results.A transmit/receive（T/R） module was developed successful by using this thermal matching technique design.
出处
《电子工艺技术》
2011年第3期141-144,共4页
Electronics Process Technology
关键词
铝盒体
LTCC基板
热应力
热膨胀匹配
Aluminum alloy package
LTCC substrate
Thermal stress
Match of linear thermal expansion
