摘要
本文介绍了在金属封装中目前正在使用和开发的金属材料。这些材料不仅包括金属封装的壳体或底座、引线使用的金属材料,也包括可用于各种封装的基板、热沉和散热片的金属材料。为适应电子封装发展的要求,国内开展对金属基复合材料的研究和使用将是非常重要的。
Metallic materials used and developed at present in metal packaging were introduced in this paper, which not only included that of the housings or bases, leads used for metal packaging, but also included that of the substrates, heat sinks and heat spreaders applied in various types of packagings. It is very important to research and apply the metal matrix composites for us in order to meet increasing requirements of electronic packagings.
出处
《电子与封装》
2005年第3期6-15,共10页
Electronics & Packaging
关键词
金属封装
底座
热沉
散热片
金属基复合材料
Metal packaging Base Heat sink Heat spreader Metal matrix composites
