摘要
在2.0 A/dm2、24°C和空气搅拌条件下,采用由60 g/L Cu SO4·5H2O、200 g/L H2SO4、60 mg/L Cl-和4种添加剂组成的酸性镀铜液对印制线路板通孔进行电镀铜。以PCB通孔孔口、孔中心铜层厚度和镀液的深镀能力为指标,通过正交试验对添加剂聚二硫二丙烷磺酸钠(SPS)、聚乙二醇(PEG-10000)、季铵盐类化合物(MX-86)和嵌段聚醚类化合物(SQ-5)的用量进行优化,得到添加剂的最优组合为:SPS 20 mg/L,SQ-5 0.5 g/L,PEG-10000 0.2 g/L,MX-86 20 mg/L。采用该配方对深径比为8∶1的通孔电镀时,深镀能力在90%以上,铜层的延展性和可靠性均能满足印制线路板的工业应用要求。
Copper plating was carried out on the through hole surface of printed circuit board in an acidic bath comprising CuSO4·5H2O 60 g/L, H2SO4 200 g/L, Cl^- 60 mg/L, and 4 types of additives under the conditions of 24 ℃, 2.0 A/dm^2, and air agitation. The dosages of additives including disodium 3,3＇-dithiobis-l-propanesulfonate （SPS）, polyethylene glycol （PEG-10000）, quaternary ammonium compound （MX-86）, and block polyether compound （SQ-5） were optimized by orthogonal test using the thicknesses of copper coating on the mouth and at the center of through hole and the throwing power of bath as the indexes. The optimal composition of additives was obtained as follows： PS 20 mg/L, SQ-5 0.5 g/L, PEG-10000 0.2 g/L, and MX-86 20 mg/L. The throwing power is at least 90% when plating on through holes with a depth-to-diameter ratio of 8：1, and both ductility and reliability of the copper coatings obtained meet the industrial application requirements.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2014年第24期1049-1052,共4页
Electroplating & Finishing
关键词
印制电路板
通孔
电镀铜
添加剂
深镀能力
printed circuit board
through hole
copperplating
additive
throwing power
