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电解铜箔表面处理技术及添加剂研究进展 被引量:18

Research progress of electrolytic copper foil surface treatment technology and additives
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摘要 随着5G通讯、新能源汽车等高端产业的发展,对电解铜箔产品性能提出更高的要求。表面处理技术是铜箔生产中极为重要的一项工艺技术,是解决铜箔绿色环保生产和获得高性能电解铜箔的主要途径。本文从国内外铜箔研究现状出发,归纳了包含粗化、固化、合金化、钝化、硅烷化等工艺流程的表面处理技术,并对每道工序中电解液的成分以及电沉积的影响因素进行分类总结,综述了粗化工序中添加剂的分类及研究现状与技术进展,重点阐述了包括晶粒细化剂、整平剂、光亮剂、表面活性剂与无机盐等各添加剂的作用机理及其对铜箔组织形貌和性能变化的影响规律,展望了我国铜箔的发展方向,为我国自主开发高性能铜箔生产技术提供参考。 With the development of high-end industries,such as 5G communications and new-energy vehicles,the higher requirements for the capabilities of electrolytic copper foil products were put forward.Using an extremely important technology,the electrolyticcopper foil surface treatment is regarded as a primary way for solving copper foil green production problem and obtaining high performance coating copper foil.Here,the present domestic and foreign research status of copper foil surface treatment including coarsing process,curing process,alloying process,passivation process,silanization process,etc,were documented and summarized.Especially,the composition of the electrolyte in each process and the influencing factors of electrodeposition were presented and analyzed,respectively.Moreover,we reviewed the research status and classification of additives in coarsening progress,and emphasized the mechanism of each additives including grain refiner,leveling agent,brightener,surfactant and inorganic additive,as well as the effects of additives on morphology and properties of copper foil.Finally,the future development direction of copper foil in China was pointed out.We believe that this review will provide a reference for our country independent development of high-performance copper foil production technology.
作者 师慧娟 陆冰沪 樊小伟 李大双 郑小伟 刘耀 谭育慧 唐云志 SHI Hui-juan;LU Bing-hu;FAN Xiao-wei;LI Da-shuang;ZHENG Xiao-wei;LIU Yao;TAN Yu-hui;TANG Yun-zhi(Faculty of Materials Metallurgy and Chemistry,Jiangxi University of Science and Technology,Ganzhou 341000,China;Anhui Tongguan Copper Foil Co.,Ltd.,Chizhou 247100,China)
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2021年第5期1270-1284,共15页 The Chinese Journal of Nonferrous Metals
基金 国家自然科学基金资助项目(21671086,21761013) 赣州市重点研发计划资助项目(赣市科发〔2019〕60号)。
关键词 电解铜箔 表面处理 添加剂 作用机理 组织 性能 electrolytic copper foil surface treatment additive function mechanism structure performance
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