摘要
电子产品的轻薄短小的发展趋势要求印制线路板的布线密度越来越高,这就使得板上的孔(包括通孔、埋孔和盲孔)径必须越来越小。在导通盲孔上直接叠孔的结构是实现最高布线密度的有效方法之一。作者通过水平脉冲电镀进行了微盲孔填孔电镀实验,在最佳的工艺条件下,在厚径比达到1.4:1的情况下仍然获得了良好的填孔效果,并对影响微盲孔填孔能力的一些因素进行了初步的探讨。
With the electronics industry being striven towards miniaturization continuously, the density of printed wiring board(PWB)are becoming higher and higher, and the hole diameter of the blind micro-via(BMV), through hole (TH)and buried hole (BH)in the PWB are also becoming smaller and smaller. The structure of via-on-via is a most effective method to obtain the highest interconnection density.The author used horizontal pulse plating technology to do some experience of BMV tilling plating, and in the optimal condition, the BMV which the aspect ratio(AR) is 1.4:1 was also well filled. The influence factors on BMV filling plating are also discussed.
出处
《印制电路信息》
2004年第7期42-45,59,共5页
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