摘要
随着电路技术及SMT技术的飞速发展的要求,传统PCB板转向HDI板的大量生产制作,因此需要相应配套设施投资;本文介绍了一种利用常规线路板配置设备进行HDI板填孔、通过填孔工艺技术的控制确保填孔一次合格率的HDI板填孔生产工艺方法。
With the rapid development in electronic circuit technology and SMT,the traditional PCB is changing to mass production of HDI boards, and large investment for the advanced facilities is needed. This article introduces a hole plugging process for HDI boards, using conventional process equipment. High hole plug yield can reached through special process control.
出处
《印制电路信息》
2004年第2期58-62,共5页
Printed Circuit Information
