摘要
文章定量分析了半固化片对盲埋孔填胶的影响因素,在此基础上,正交分析确定了盲埋孔填胶的主要控制因素(填胶深度和PP片数量),为前端工程设计和控制提供依据。最后,建立盲埋孔填胶的胶体流动模型,即在层流状态下的渗流模型,服从达西定律。
The factors which affect the filling Blind-via/Buried-via with prepreg were analyzed quantitatively by orthogonal analytical methods in this article, then, the key ones （the depth of filling and the number of prepreg ） were concluded to provide the theoretical basis for the engineering design. Subsequently, the theoretical model of colloidal lfow in iflling Blind-via/Buried-via with prepreg was established by using seepage under the laminar lfow relative to Darcy＇s law.
出处
《印制电路信息》
2014年第4期186-189,共4页
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