摘要
HDI板在生产过程中用LD半固化片填胶的加工工艺。分别通过理论计算分析了LD半固化片(1037)理论含胶量及实际所需胶量的一种量化关系,并以田口-DOE实验法探讨了LD半固化片填胶过程中表面凹陷产生的主要原因,对制作HDI使用半固化片直接填孔选材与工艺有重要的参考意义。
The processing technology of resin filling, using LD Prepreg in HDI production process, was elaborated in this article. The main reason of the filling surface indentation of LD Prepreg（1037） and a quantitative relationship of the theoretical and the actual desired gel content, which have important reference value for choosing Prepreg material directly to fill holes of produced HDI and produced technology, was analyzed by the theoretical calculation and probed by the Taguchi experiment method, respectively.
出处
《印制电路信息》
2012年第4期164-167,共4页
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