摘要
层压时,板边溢胶会导致板边介质层厚度较板中间薄、介电常数较板中间高。板边介质层厚度、介电常数偏差均会对阻抗造成影响。本文对此差异性进行了试验和探讨,并明确相应的设计规则,确保阻抗附连板忠实代表客户的设计要求。
Because of resin lfow during lamination, mediμm thickness in the center of board is usually thicker than that on the edge, and dielectric constant of mediμm on the edge is higher than that in the center. The purpose of this article is to discuss and research the difference, conifrm the design rule, and make sure the coupon can represents customer’s design requirement.
出处
《印制电路信息》
2014年第4期118-121,共4页
Printed Circuit Information
关键词
含胶量
厚度均匀性
阻抗控制
阻抗差异性
Resin Content
Thickness Uniformity
Impedance Control
Impedance Difference
