摘要
随着科技的发展,电子设备对信息的快速传递与体积的精简有了更高的要求,高频盲埋孔板需求不断增长。本文通过对高频PP填胶过程进行建模,梳理和研究了板厚、孔径、缓冲材料等因素对填充饱满度的影响,界定了采取高频PP制作盲孔板的能力。
With the development of technology, the higher speed information transferring and smaller volume are required on electronic equipments, and the requirement of high frequency board with blind hole and buried hole is increasing. Though the modeling of iflling blind hole by high frequency prepreg, this article sorted out and took research on the influence of board thickness, hole diameter, cushioning material and other factors worked on iflling blind hole, and told the capability of iflling blind hole by high frequency prepreg.
出处
《印制电路信息》
2014年第4期29-32,共4页
Printed Circuit Information
关键词
高频
盲孔填充
板厚
孔径
覆型材料
High Frequency
Filling Blind Hole
Board Thickness
Hole Diameter
Cushioning Material
