摘要
综述了无染料酸性镀铜添加剂MN系列的发展状况及几类无染料添加剂的优点和不足,比较了无染料系列添加剂与有机染料系列的性能差异,对目前最好的无染料添加剂系列EPI进行了简要的介绍,并展望了未来添加剂的发展方向。
A review was given on the current state and development of MN series additives for non-dye acidic copper electroplating.The advantages and disadvantages of several types of additives for non-dye acidic electrodeposition of copper were summarized.A comparison was made with respect to the properties of the non-dye additives and dye additives.Moreover,the most widely accepted EPI series additives as representative non-dye additives were briefed,and some suggestions were given with respect to the development and prospect of the additives for copper electroplating.
出处
《材料保护》
CAS
CSCD
北大核心
2006年第6期38-40,共3页
Materials Protection
关键词
酸性镀铜
添加剂
无染料
综述
acidic copper electroplating
additive
non-dye
review
