摘要
Si_3N_4陶瓷的连接技术作为其广泛使用的重要前提,受到了国内外学者的广泛关注。文中概述了近年来国内外几种Si_3N_4陶瓷与自身及其它金属材料的连接技术,涉及的连接方法包括活性金属钎焊、固相扩散连接、瞬时液相扩散连接和玻璃焊接,重点介绍了Si_3N_4陶瓷连接时的接头界面结构、连接机理及接头质量。
As an important prerequisite for their application, the joining technology of Si3N4 ceramic has attained special attention by the worldwide researchers. Several methods to join Si3N4/Si3N4 and Si3N4/metal were introduced, which includes reactive metal brazing, solid diffusion bonding, transient liquid phase diffusion bonding and glass solder welding. The introduction puts emphasis on the interfacial structure, joining mechanism and the properties of the Si_3N_4 joints.
出处
《焊接》
北大核心
2011年第11期1-6,共6页
Welding & Joining
基金
国家自然科学基金资助项目(50805038)
黑龙江省杰出青年基金资助项目(2004793)
关键词
SI3N4陶瓷
扩散连接
钎焊
瞬时液相扩散连接
Si_3N_4 ceramic
diffusion bonding
brazing
partial transient liquid phase bonding
