摘要
论述了化学镀铜新工艺及其镀液的成份、作用及对镀层的影响，并叙述其组成和镀层的表面形态。详述了此工艺在印刷线路板上孔壁的导电化。
New technology and its bath composition, fuction as well as effects on deposit are discussed and its composition and surface morphology stated. Its applications in conductivity of hole wall, treatment of inside layer and seal of electromagnetic wave are detailed.
出处
《电镀与环保》
CAS
CSCD
北大核心
1999年第4期5-8,共4页
Electroplating & Pollution Control
关键词
化学镀铜
基本特性
电子工业
新工艺
Electroless copper processFundamental characteristicsApplication
