摘要
研究了以次磷酸钠为还原剂的化学镀铜过程。分析了温度、pH、硫酸镍含量对化学镀铜沉积速率的影响及镀层的表面形貌和结构。结果表明,沉积速率随着镀液温度、pH和N i离子浓度的提高而增大。镀层组分含量和XRD实验结果表明镀层为铜镍合金,呈面心立方结构,晶面间距d与晶胞参数a与标准Cu-N i的相比略大。SEM实验表明,镀层表面形貌为团粒状,颗粒大小较不均匀。
The process of the electroless copper plating using sodium hypophosphite as reductant was studied. The influences of temperature, pH, nickel sulphate content on deposition rate of copper electroless plating as well as the surface morphology and structure of the deposit were analyzed. The results show that the deposition rate is accelerated with increasing bath temperature, pH value and the concentration of nickel ion. Both deposit composition and XRD results indicate that the deposits are Cu-Ni alloy with face-centered cubic structure. Its structural parameters of d and a are slightly larger than that of the standard Cu-Ni alloy. SEM experiment displays that the deposit has a surface morphology of granular structure with uneven grain sizes.
出处
《电镀与涂饰》
CAS
CSCD
2006年第7期1-3,14,共4页
Electroplating & Finishing
基金
国家科技攻关计划项目(2004BA325C)
关键词
化学镀铜
次磷酸钠
沉积速率
铜镍合金
electroless copper plating
sodium hypophosphite
deposition rate
Cu-Ni alloy
