摘要
在碳纤维表面先化学镀铜再电镀铜可获得具有一定厚度且均匀的铜镀层。研究了甲醛、配位剂、稳定剂等用量、pH值、温度、电流密度、电解时间等对碳纤维增重率的影响,确定了镀铜的最佳配方,并用扫描电镜验证了镀铜效果。结果表明,最佳化学镀铜配方为16g/LCuSO4·5H2O,25g/LEDTA·2Na,15g/L酒石酸钾钠,15g/LNaOH,5mg/L2,2′联吡啶,15mg/LK4Fe(CN)6,6mL甲醛(分析纯)。本法既较好地解决了碳纤维束的黑心问题,又可获得较厚的镀层,且镀层与碳纤维的结合更牢。
Uniform and thick copper plating was deposited on carbon fiber by combining electroless plating copper with electroplating copper. The effects of formaldehyde, complexing agent, stabilizer, pH value, temperature, current density, and electrolysis time on the deposition rate were investigated. Thus the optimal formulation for the copper deposition on the carbon fibers was determined, and the resulting copper plating was characterized using a scanning electron microscope. As the results, the optimum formulation for the electroless copper plating was determined to be 16 g/L CuSO_(4)·5H_(2)O, 25 g/L EDTA·2Na, 15 g/L sodiumpotassium tartrate, 15 g/L NaOH, 5 mg/L 2,2′dipyridine, 15 mg/L K_(4)Fe(CN)_(6), and 6 mL/L HCHO(A.R.). It was able to get rid of the coreblacking of the carbon fibers making use of the developed electroless Cu plating plus Cu electroplating technology and the target copper coating was thick and well adhered to the carbon fibers.
出处
《材料保护》
CAS
CSCD
北大核心
2005年第4期32-34,2,共3页
Materials Protection
关键词
化学镀铜
电镀铜
碳纤维
沉积速率
electroless copper plating
copper electroplating
carbon fiber
deposition rate
