摘要
本文介绍了一种应用于印制电路板化学沉铜工艺的新型沉薄铜药水。该产品具有简易分析及操作;沉积速度慢、厚度薄且背光能力优异、背光稳定性好;药水表面张力小、可满足高厚径比(13:1以上)板料生产要求;抗热冲击能力优异、同时能适应于高Tg和普通Tg板料等多种板料的优点。
The article introduced an excellent new electroless copper plating solution for thinner copper deposit.It is very easy to analyze and operate;it has the merit of low deposit,excellent back light and good stability of back light;small surface strength;it can meet the quality needs of high aspect ratio board.It has outstanding thermal shock ability and is suitable for normal Tg and high Tg material.
出处
《印制电路信息》
2009年第S1期186-191,共6页
Printed Circuit Information
关键词
化学镀铜
稳定性
背光
Electroless Copper Plating
Stability
Back light
