摘要
助焊剂是电子组装技术中最重要的材料之一,通过其去除材料表面氧化膜及污染物等,保证钎料和母材之间很好地润湿,形成良好焊点。介绍了助焊剂的作用与组成、分类与性能要求以及涂覆方式和工艺评定,有助于实际生产中助焊剂的选择与使用。
The flux is one of the important and contamination of surface for solder materials materials in electronic assembly, which get rid of oxide in order to shape good solder joints by wetting between solder and solder pad. Introduce the function and components, kinds and performance, work styles and process assess of flux, and help to choice and use of flux in practice.
出处
《电子工艺技术》
2009年第3期181-184,共4页
Electronics Process Technology
关键词
电子组装
无铅化
助焊剂选择
Electronic assembly
Lead - free
Flux choice
