摘要
研制了一种以水作溶剂,不含挥发性有机化合物(VOCs)的水基免清洗助焊剂。根据信息产业部制定的免清洗液态助焊剂标准,使用Sn-3.8Ag-0.7Cu无铅焊料,对该免清洗助焊剂进行了性能检测。结果表明:该助焊剂在外观、稳定性、粘性、卤化物含量等方面都符合标准,对无铅焊料助焊效果较好,无卤化物,无毒,无刺激性气味,环保,安全,节省成本。对无VOCs水基免清洗助焊剂在波峰焊中的应用给出一些建议。
A new type of no-clean flux which is VOCs-free and water-based was developed. After many performance tests had done according to the industry standards which was stipulated by department of information industry. The research results show that the fluxes have fulfilled the requirements of the standards of no-clean flux. The appearance, stability, viscosity and content of halide are up to the standard, for example. The flux works well with lead-free solder, besides it is halogen-free, nontoxic and odourless. Thus it is a type of environmentally friendly flux, safe and economical of cost. Lastly, some suggestions have made when the water-based, no-clean flux is applied to the wave soldering.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2005年第12期26-28,共3页
Electronic Components And Materials
基金
北京市教育委员会资助项目(2002KJ020)
北京市自然科学基金资助项目(2012003)
国家"863"计划资助项目(2002AA322040)
