摘要
针对镀镍盒体表面易被氧化等原因导致可焊性下降,且可选无铅焊料Sn-58Bi焊膏的情况下,通过在空气中直接加热焊接、借助真空炉在无氧环境中焊接等方式,确认空洞率高与空气中氧气的存在无关。最终通过在焊接过程中另加自配的助焊剂,将焊接后的空洞率控制在5%以内,满足了焊接要求。
Based on the decreasing solderability of the nickel layer because of the oxidation. And the solder is Sn-58Bi, which is lead-free. We weld some aluminium alloy boxes with the plane heater in the air, then weld the others in the vacuum stove without oxygen. These experiments show that the void rate has no connection with the oxygen in the air. We solve the problem by adding flux which is confected by ourselves in the solder Sn-58Bi. And the void rate is within 5 %.
出处
《电子科技》
2012年第7期139-141,共3页
Electronic Science and Technology
