摘要
无焊剂软钎焊技术因其焊接过程中无焊剂残留,被广泛应用于光电器件和芯片倒装焊等方面。首先对无焊剂软钎焊的原理和工艺进行了阐述,并指出气氛保护和等离子处理是无焊剂软钎焊的两个主要技术途径。基于上述分析,采用无焊剂软钎焊工艺开展钎料润湿性研究。结果表明,还原气氛保护和等离子处理后,焊料的润湿铺展性能显著提高。
With the development of miniaturization, lightweight and integration in electronic packaging, interconnection space of microelectronic device have been decreased; meanwhile, the requirements of device＇s reliability have been increased. For excellent electrical, mechanical and thermal properties, the solder joint become to one of the most important way in electronic packaging and interconnection. Because no flux residues in device, the flux-free soldering has been used in optoelectronic device and flip-chip widely. The principle and processing of flux-free soldering was introduced, and pointed out that the reducing atmosphere protection and plasma treatment was two main ways. Based on the above analysis, the wetting and spreading of solder was studied by flux-free soldering, the results shown that the wetting and spreading properties of soldering were improved by reducing atmosphere and plasma treatment during soldering.
出处
《电子工艺技术》
2014年第1期19-21,25,共4页
Electronics Process Technology
基金
国防基础科研项目(项目编号:AA20132016)
关键词
无焊剂软钎焊
润湿铺展
还原气氛
等离子处理
Flux-free soldering
Wetting and Spreading
Reducing atmosphere
Plasma treatment
