摘要
三维封装技术是近几年正在发展的电子封装技术,它的实质是在X、Y平面的基础上进一步向Z方向发展的微电子高密度组装。文章介绍了芯片封装发展的历史、趋势和三维封装技术在半导体封装工业中所起的重要作用,给出了用Cadence公司先进的EDA软件AllegroPackageDesigner进行3D封装的设计流程和使用该软件实现双层芯片叠层封装的3D封装设计,并对芯片高速信号管脚的EDA设计方法加以了说明。
This paper introduces the developing and future trends of semiconductor packaging technology. It also points out that the 3D packaging technology has a wide and important role in the semiconductor packaging industry. A design flow of the 3D packaging is using allegro package designer which is an advanced EDA software of cadence corporation is presented. This software doing a stacked-die packaging design is used. The design method of high speed signal pin is also introduced.
出处
《电子与封装》
2007年第11期5-8,17,共5页
Electronics & Packaging
