摘要
晶圆级封装、多芯片封装、系统封装和三维叠层封装是近几年来迅速发展的新型封装方式,在推动更高性能、更低功耗、更低成本和更小形状因子的产品上,先进封装技术发挥着至关重要的作用。晶圆级芯片尺寸封装(WCSP)应用范围在不断扩展,无源器件、分立器件、RF和存储器的比例不断提高。随着芯片尺寸和引脚数目的增加,板级可靠性成为一大挑战。系统封装(SIP)已经开始集成MEMS器件、逻辑电路和特定应用电路。使用TSV的三维封装技术可以为MEMS器件与其他芯片的叠层提供解决方案。
WLP,MCP,SIP,3D stacked packaging are recently emerging packaging techniques.These new packaging types play the most important role in pushing the electronic devices to more excellent performance,lower power and lower cost.WCSP has a widely range of application,in which passive components,discrete devices,RF and storages have a high scale among the all components.SIP has integrated MEMS device,logic circuit and ASIC.3D packaging using TSV can provide stack solution for MEMS device and other chips.
出处
《电子与封装》
2010年第6期8-11,共4页
Electronics & Packaging
