摘要
随着空间飞行器的电子设备向着小型化和集成化的方向发展,对综合电子系统提出了高性能、轻质化、集成化、小型化等要求。系统级封装(System in Package,SiP)已经成为重要的先进封装和系统集成技术,是未来空间飞行器综合电子系统小型化和多功能化的重要技术路线。介绍了国内外综合电子系统的发展现状和趋势,在分析空间飞行器对综合电子系统的需求基础上,对基于SiP技术的空间飞行器综合电子系统组成和关键技术进行了介绍,总结了基于SiP技术的综合电子系统的特点与优势。
The development of spacecraft electronic equipment toward miniaturization and integration has been entailing high-performance, lightweight and miniaturized integrated electronic systems. System in Package（SiP） has now become one of the most promising technologies for advanced packaging and system integration, which is pivotal in the future development of integrated electronic system. The paper at first introduces the constitution and critical technologies of SiP-based integrated electronic system and then concludes its advantages by analyzing the status quo, development trends and demands.
出处
《电子与封装》
2016年第9期6-9,27,共5页
Electronics & Packaging
