摘要
介绍了SMT焊点质量常用检测方法,包括从外观到内部组织机构、从电性能到机械性能等各项检测的原理和应用范围,并分析了在工艺、制造和使用过程中出现的各种焊点失效机理,并从焊点几何结构设计、钎料性质及材料热匹配等方面提出了降低失效率、提高焊点可靠性的途径。
This article introduces principium and applications of basic inspection methods on solder joint quality in SMT, analyses the failure mechanism of solder joint attributing to technology, manufacture and service, and then proposes approach to improving reliability of solder joint based on solder joint design, solder properties and material＇s CTE.
出处
《电子工业专用设备》
2005年第9期26-33,共8页
Equipment for Electronic Products Manufacturing
关键词
表面组装技术
焊点质量
检测
可靠性
热循环
Surface MountTechnology（SMT）
SolderJointQuality
Inspection
Reliability
Thermal Cycle
