摘要
文章主要讨论了不同基材的高频高速印制电路板的钻孔特性差异。在此基础上探索与高频高速印制电路板材料性能钻孔特性的盖垫板匹配性,以及盖垫板搭配使用对高频高速印制电路板钻孔加工技术和孔内残胶(即引起ICD)的优化改善方案。
This paper mainly discusses the differences of drilling performance of different high-frequency and high-speed laminates and PCB, and to explore the matching for the entry and backup boards and the drilling performance of high-frequency and high-speed PCB, and to study the improvement scheme for drilling technology and hole residue of high-frequency and high-speed PCB using different entry and backup boards.
出处
《印制电路信息》
2015年第3期98-105,共8页
Printed Circuit Information
关键词
盖垫板
钻孔
高频高速PCB
基板材料
九壁与孔环互连缺陷
Entry and Backup Boards
Drilling
High-Frequency and High-Speed PCB
Laminates
ICD(Internal Connection Defects)
