摘要
低压差线性稳压器(LDO)是一种重要的电源管理芯片,其可靠性关乎电子设备的稳定和安全。该文以某低压差线性稳压器经环境试验筛选后发生功能失效为案例,通过开封观察、断口形貌分析、材质分析、表面成分分析等手段,确定该稳压器的失效模式为键合丝断路,失效原因为导电胶的粘接界面受有机硅污染,导致晶片与底座在环境试验过程中发生脱离并拉断键合丝,并针对该案例提出改进建议。
Low-drop-out linear regulator(LDO) is an important power management chip. Its reliability is related to the stability and safety of electronic equipment. In this paper, a LDO that failed after environmental test was taken as an example, through unsealing observation, fracture morphology analysis, material analysis, surface composition analysis and other means, it is determined that the failure mode of the regulator is the open circuit of the bonding wire, the failure reason is that the bonding interface of the conductive adhesive is polluted by organic silicon, resulting in the separation of the chip and the base during the environmental test, and broke the bonding wire. Some improvement suggestions were put forward for this case.
作者
王琳
黄彦霖
蔡志刚
赵鹏
Wang Lin;Huang Yan-lin;Cai Zhi-gang;Zhao Peng(The Fifth Electronics Research Institute of Ministry of Industry and Information Technology,Guangdong Guangzhou 511370)
出处
《电子质量》
2022年第7期54-60,74,共8页
Electronics Quality
关键词
低压差线性稳压器
断路
导电胶
失效分析
low-drop-out linear regulator
open circuit
conductive adhesive
failure analysis
