摘要
烧结收缩率是LTCC基板制造中的一项关键性技术指标,受材料和生产工艺的影响较大,导致其一致性差,致使基板尺寸难以精确控制。本文主要讨论了层压和烧结工艺对LTCC基板烧结收缩率的影响,并提出了改进方案。通过设计实验,验证了改进方案的有效性,提升了LTCC基板烧结收缩率的一致性。
Sintering shrinkage is a key technical index in the manufacturing of LTCC substrate,the influence of material and production process on it is great,which results in poor consistency and difficult to accurately control the substrate size.This paper discusses the influence of lamination and sintering process on the sintering shrinkage of LTCC substrate,and puts forward the improvement scheme.Through the design experiment,the effectiveness of the improved scheme is verified,and the consistency of sintering shrinkage of LTCC substrate is improved.
作者
王亚东
张潇
杨兴宇
秦超
WANG Ya-dong;ZHANG Xiao;YANG Xing-yu;QIN Chao(Micro-package Center,The 2nd Research Institute of China Electronics Technology Group Corporation,Taiyuan 030024 China)
出处
《科技创新与生产力》
2021年第5期74-76,共3页
Sci-tech Innovation and Productivity
